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24001 BZT52C10 15CH60 7108M MD3880 BYZ50K22 L50NH3LL 00104
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 g d s gate drain source to-220ab AUIRF9Z34N s d g d features  advanced planar technology  p-channel mosfet  dynamic dv/dt rating  175c operating temperature  fast switching  fully avalanche rated  repetitive avalanche allowed up to tjmax  lead-free, rohs compliant  automotive qualified* description specifically designed for automotive applications,this cellular design of hexfet? power mosfets utilizes the latest processing techniques to achieve low on-resistance per silicon area. this benefit combined with the fast switching speed and ruggedized device design that hexfet power mosfets are well known for, provides the designer with an extremely efficient and reliable device for use in automotive and a wide variety of other applications. s d g absolute maximum ratingsstresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. ambient temperature (t a ) is 25c, unless otherwise specified. hexfet ? is a registered trademark of international rectifier. * qualification standards can be found at http://www.irf.com/ www.irf.com 1 v (br)dss -55v r ds(on) max. 0.10 i d -19a parameter units i d @ t c = 25c continuous drain current, v gs @ 10v i d @ t c = 100c continuous drain current, v gs @ 10v a i dm pulsed drain current p d @t c = 25c power dissipation w linear derating factor w/c v gs gate-to-source voltage v e as single pulse avalanche energy (thermally limited)  mj i ar avalanche current a e ar repetitive avalanche energy mj dv/dt peak diode recovery dv/dt  v/ns t j operating junction and t stg storage temperature range c soldering temperature, for 10 seconds (1.6mm from case ) mounting torque, 6-32 or m3 screw thermal resistance parameter typ. max. units r jc junction-to-case  CCC 2.2 r cs case-to-sink, flat, greased surface 0.50 CCC c/w r ja junction-to-ambient CCC 62 -5.0 6.8 180 -10 68 0.45 20 max. -19 -14 -68 -55 to + 175 300 10 lbf  in (1.1n  m) automotive grade downloaded from: http:///

  
 
       
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 *%  5'()  6    ,3  7  r is measured at tj approximately 90c. s d g s d g static electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units v (br)dss drain-to-source breakdown voltage -55 CCC CCC v v (br)dss / t j breakdown voltage temp. coefficient CCC 0.05 CCC v/c r ds(on) static drain-to-source on-resistance CCC CCC 0.10 v gs(th) gate threshold voltage -2.0 CCC -4.0 v gfs forward transconductance 4.2 CCC CCC s i dss drain-to-source leakage current CCC CCC -25 a CCC CCC -250 i gss gate-to-source forward leakage CCC CCC 100 na gate-to-source reverse leakage CCC CCC -100 dynamic electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units q g total gate charge CCC CCC 35 q gs gate-to-source charge CCC CCC 79 nc q gd gate-to-drain ("miller") charge CCC CCC 16 t d(on) turn-on delay time CCC 13 CCC t r rise time CCC 55 CCC t d(off) turn-off delay time CCC 30 CCC ns t f fall time CCC 41 CCC l d internal drain inductance CCC 4.5 CCC between lead, nh 6mm (0.25in.) l s internal source inductance CCC 7.5 CCC from package and center of die contact c iss input capacitance CCC 620 CCC c oss output capacitance CCC 280 CCC pf c rss reverse transfer capacitance CCC 140 CCC diode characteristics parameter min. typ. max. units i s continuous source current CCC CCC -19 (body diode) a i sm pulsed source current CCC CCC -68 (body diode)  v sd diode forward voltage CCC CCC -1.6 v t rr reverse recovery time CCC 54 82 ns q rr reverse recovery charge CCC 110 160 nc t on forward turn-on time intrinsic turn-on time is negligible (turn-on is dominated by ls+ld) v ds = -25v ? = 1.0mhz, see fig. 5 t j = 25c, i f = -10a di/dt = 100a/ s  conditions v gs = 0v, i d = -250 a reference to 25c, i d = -1ma v gs = -10v, i d = -10a  v ds = v gs , i d = -250 a v ds = -55v, v gs = 0v v ds = -44v, v gs = 0v, t j = 150c mosfet symbol v dd = -28v i d = -10a r g = 13 t j = 25c, i s = -10a, v gs = 0v  showing the integral reverse p-n junction diode. conditions r d = 2.6 , see fig. 10  v gs = 0v conditions v ds = -25v, i d = -10a i d = -10a v ds = -44v v gs = 20v v gs = -20v v gs = -10v, see fig. 6 & 13  downloaded from: http:///

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%' ()(* $ * !# +, ! ,-, qualification information ? to-220 n/a qualification level automotive (per aec-q101) ?? comments: this part number(s) passed automotive qualification. irs industrial and consumer qualification level is granted by extension of the higher automotive level. charged device model class c5 (+/- 2000v) ??? aec-q101-005 moisture sensitivity level rohs compliant yes esd machine model class m3 (+/- 250v) ??? aec-q101-002 human body model class h1b (+/- 800v) ??? aec-q101-001 downloaded from: http:///

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 23!2'  1 10 100 0.1 1 10 100 d ds 20 s pulse width t = 25c c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) vgs top - 15v - 10v - 8.0v - 7.0v - 6.0v - 5.5v - 5.0v bottom - 4.5v -4.5v 1 10 100 0.1 1 10 100 d ds a -i , drain-to-source current (a) -v , drain-to-source voltage (v) vgs top - 15v - 10v - 8.0v - 7.0v - 6.0v - 5.5v - 5.0v bottom - 4.5v -4.5v 20 s pulse width t = 175c c 1 10 100 4567891 0 t = 25c j gs d a -i , drain-to-source current (a) -v , gate-to-source voltage (v) v = -25v 20 s pulse width ds t = 175c j 0.0 0.5 1.0 1.5 2.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180 j t , junction temperature (c) r , drain-to-source on resistance ds(on) (normalized) a v = -10v gs i = -17a d downloaded from: http:///

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   23!6' ,1# 65 1,   23!'!1# 5 1,  23!5  71, 0 4 8 12 16 20 0 1 02 03 04 0 g gs a -v , gate-to-source voltage (v) q , total gate charge (nc) for test circuit see figure 13 i = -10a v = -44v v = -28v d dsds 0.1 1 10 100 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t = 25c j v = 0v gs sd sd a -i , reverse drain current (a) -v , source-to-drain voltage (v) t = 175c j 1 10 100 1000 1 10 100 operation in this area limited by r ds(on) 10ms a -i , drain current (a) -v , drain-to-source voltage (v) ds d 10 s 100 s 1ms t = 25c t = 175c single pulse cj 0 200 400 600 800 1000 1200 1 10 100 c, capacitance (pf) a ds -v , drain-to-source voltage (v) v = 0v, f = 1mhz c = c + c , c shorted c = c c = c + c gs iss gs gd ds rss gd oss ds gd c iss c oss c rss downloaded from: http:///

  5 ,2$2'    5 ,2$8-$   4&$ $%-22 $$!9:  '  4&$ $' 1# '2$!  4  /4  1    0.1 %   4  4    89% + - v ds 90% 10% v gs t d(on) t r t d(off) t f 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) 25 50 75 100 125 150 175 0 5 10 15 20 t , case temperature ( c) i , drain current (a) c d downloaded from: http:///


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- %,3 1#'  q g q gs q gd v g charge ()1 d.u.t. v ds i d i g -3ma v gs .3 f 50k .2 f 12v current regulator same type as d.u.t. current sampling resistors + -   <$! -8-$   <$! -2'  t p v ( br ) dss i as r g i as 0.01 t p d.u.t l v ds v dd driver a 15v -20v 0 100 200 300 400 500 25 50 75 100 125 150 175 j e , single pulse avalanche energy (mj) as a starting t , junction temperature (c) i top -4.2a -7.2a bottom -10a d downloaded from: http:///


  

  p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-appliedvoltage reverserecovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period + - + + + - - -      4  ?         ? .      8 1 :8: ? 89%/8  9 %  
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ordering information base part number package type standard pack complete part number form quantity AUIRF9Z34N to-220 tube 50 AUIRF9Z34N downloaded from: http:///

 
 

 
   
   
  

 
 



  
   



  
   
    
   
 
 
    


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